Technologies for manufacture of MIDs: Miniaturized moulded interconnect devices

November 26 2008, DTU Meeting room 1, Building 101

Seminar photos here.

Moulded interconnect devices (MIDs) are thermoplastic circuit carriers with a patterned surface metallization which combines mechanical and electrical functionalities on a single device.

Integration of micro metallic structures in polymer devices is a broad multi-disciplinary research field, consisting of various combinations of mechanical, chemical and physical fabrication methods. Some of these combinations have been known for years and have mostly been used for decorative purposes. Other combinations or methods are very new and developing. MIDs contain huge possibilities for many applications in micro electro-mechanical-systems because of their potential in reducing the number of components, process steps and finally in miniaturization of the product.

The seminar will present state-of-the-art on materials (polymers and metals) as well as manufacturing processes and process chains. The industrial application of MID technology will be represented by examples.

PROGRAM

08:30–09:00	Arrival
09:00-09:15	Introduction, welcome Hans Nørgaard Hansen, professor, Department of Mechanical Engineering (DTU Mekanik), Technical University of Denmark.
09:15-10:00	State-of-the-art in MID production and beyond Pieter Bolt, TNO Science & Industry, The Netherlands Moulded Interconnect Devices (MID) is a generic term for technologies in which conductive paths and moulded polymer parts are integrated into one component. MID technologies give new opportunities for miniaturization or integrating electronics in complex devices, e.g. an antenna in a cell phone. Integration of functionalities into one component reduces assembly costs and product volume.  The core of MID technology is the ability to realize conductive paths on or in a polymer moulded structure. A wide range of approaches is used, such as hot embossing of metal foil patterns on a surface or electroless plating of surfaces which are made locally perceptive for metallization, either by two shot moulding or laser activation. An overview of MID technologies and applications will be given. Attention will also be given to the wider context of heterogeneous components manufacturing and perceived need for integration of processes and equipment. Dr. Pieter Bolt, M.Sc Applied Physics, Groningen University, Ph.D Technical Sciences, Eindhoven University of Technology, The Netherlands, worked for two years in Japan as researcher at the Agency of Industrial Science and Technology in Tsukuba and Hitachi Ltd. He is since more than 15 years employed by the Netherlands Organisation of Applied Scientific Research TNO, in the field of manufacturing and especially materials (metals and polymers) processing. He was manager of a TNO wide programme on micro system technology, both on application and manufacturing technology development, and is involved in a number of European networks and projects on micro manufacturing.
10:00-10:30	Process chains for miniaturized MID manufacturing Torben Tang, IPU. Moulded Interconnect Devices (MID’s) can be produced in several very different ways, each with their own advantages and disadvantages. The most well-known are insert moulding, two component injection moulding (and subsequent metallization), hot-pressing or hot-embossing, laser structuring, and many others. For every one of these possibilities a large number of variants exists, making it very difficult to get an overview of this technical field – or to choose a process chain for a certain component. This presentation will try to give a systematic overview of this multi-disciplinary area, making it possible to select the best process chain for manufacturing of a specific part. Examples will be given - both actual experience (from the Polymetal research project) and from the literature (incl. recent international conferences). Dr. Peter Torben Tang is employed by IPU as a senior consultant. He has worked with contract research for more than 15 years within different areas such as electroforming of replication tools for micro injection moulding, environmentally friendly galvanic processes, high melting point lead-free solders and selective micro metallization of polymers. He has a M.Sc. and Ph.D. degree from the Technical University of Denmark, has written more than 50 scientific publications and holds 7 patents.
10:30-10:45	Pause
10:45-11:15	Polymer materials for MID - LDS development Mr. Francis v Vehmendahl, Project Leader LDS Development, DSM Engineering Plastics B.V., The Netherlands. DSM Engineering Plastics has introduced a new grade of Xantar LDS PC/ABS suitable for Laser Direct Structuring (LDS) applications. Xantar LDS 3710 was developed for antennas in mobile telecom products such as telephones, PDAs and other applications.  A key application for Xantar LDS 3710 is the GSM antenna for a mobile phone. The antenna function is made by means of Laser Direct Structuring on a moulded part. LDS is a simple and precise technology for producing 3D molded interconnect devices. After molding, the interconnect pattern is directly written on the part and the conductive paths are plated where the plastic has been activated by the laser. The part is subsequently fixed in the housing of the mobile phone. Xantar LDS 3710 provides excellent plating properties, excellent ductility/high impact performance and surface appearance. Laser Direct Structuring offers flexibility, real 3D shaped circuitry on a plastic moulded part and design freedom. This presentation we will cover the development process of Xantar LDS 3710.
11:15-11:45	Metallization of polymers Microscope picture of the polished cross-section of a injection moulded LCP part metalized with electroless nickel (the white line). Torben Tang, senior consultant, IPU. Metallization of polymers is an important step in most of the different process chains that are used to manufacture MID’s. The metallization is done using either wet chemical processes or vacuum deposition. Both methods have their advantages and disadvantages. In case selective metallization is required, particularly with features on the micro meter scale, successful metallization of polymers is not an easy task. This presentation will cover some general procedures and considerations for metallization of polymers, as well as show some of the results from the Polymetal project on this topic.
11:45-12:15	Two component injection molding for MID fabrication Dr. Aminul Islam, Department of Mechanical Engineering (DTU Mekanik), Technical University of Denmark. Among the available MID process chains, two component (2k) injection moulding with subsequent selective metallization is one of the most industrially adaptive processes. However  the use of two component injection moulding for MID fabrication, with circuit patterns in the sub-millimeter range, is a challenge for industrial MID production. This research work demonstrates the feasibilities and challenges of MID fabrication by 2k moulding for highly precise and technically challenging applications. Dr. Aminul Islam is working as a postdoctoral research fellow at the Department of Mechanical Engineering, Technical University of Denmark under Professor Hans Nørgaard Hansen. Dr. Islam obtained his Ph.D from Technical University of Denmark in July 2008. He obtained the M.Sc (Mechanical Eng) from Dalarna University, Sweden in 2004. He graduated with B.Sc (Mechanical Eng) from the Bangladesh University of Engineering and Technology, Dhaka, Bangladesh in 2002.
12:15-13:00	Lunch
13:00-13:30	Designing polymer surfaces with covalently attached functionalities Katja Jankova, Assoc. Prof., PhD., Department of Chemical and Biochemical Engineering, Danish Polymer Centre, Technical University of Denmark. Advanced polymerization methods can be applied to covalently attach hydrophilic polymers to the surface of commodity and some engineering plastics in order to ensure easier metal deposition avoiding the use of chromic acid. A method for measuring the surface tension of polymers at high temperatures, incl. polymer melts will be briefly introduced. Some experimental investigations of its effect on polymer-polymer adhesion will be demonstrated. Katja Jankova has finished her MSc and PhD education at Assen Zlatarov University in Burgas, Bulgaria. Associate Professor in Synthesis of Polymers from the same University. Post doc at the Technical University, Vienna, Austria. From 2000 and presently she is Associate Professor in Polymer Chemistry at the Danish Polymer Centre, Department of Chemical and Biochemical Engineering, DTU. Her research interests are in the field of functional block copolymers, surfaces and coatings.
13:30-14:00	Micro insert moulding Guido Tosello, Department of Mechanical Engineering (DTU Mekanik), Technical University of Denmark. Hybrid polymer/metal insert moulded demonstrator. Polymer: polyoxymethylene (POM); metal: stainless steel (thickness: 80µm). The two materials and their interface can be seen in the scanning electron microscope images of the demonstrator cross section. Miniaturized devices with increased functionality can be obtained by means of incorporation of metal micro parts in a polymer matrix. They allow achieving both conductive circuits and mechanical functions in the same device, enabling design of MIDs with enhanced characteristics. New design principles, in-process manufacturing technologies, as well as testing methodologies have to be established in order to be able to develop such integrated devices. Insert moulding and hot embossing processes were investigated for the manufacturing of multi-material miniaturized components. A mould was developed and validated for the production of hybrid polymer/metal miniaturized parts by over moulding. Micro metal inserts with thickness down to 20 µm were moulded in a polymer matrix. This presentation will demonstrate the influence of metal surface treatment, insert thicknesses, different material combinations and different processes on the bonding strength between polymer matrix and metal part; additionally, the effect of inserts on the flow pattern in the cavity will be discussed by means of experimental as well as simulated results. Dr. Guido Tosello works as Assistant professor at the Department of Mechanical Engineering, Technical University of Denmark carrying out research in the field of precision moulding of polymer micro components. Dr. Guido Tosello holds a Ph.D. degree from the Department of Mechanical Engineering, Technical University of Denmark (2008), and a M.Sc. in Mechanical Engineering (2002) from the University of Padova (Italy).
14:00-14:30	Laser Induced Selective Activation Utilizing Auto-catalytic Electroless Plating on Polymer Surfaces Yang Zhang, Department of Mechanical Engineering (DTU Mekanik), . A new technique for selective micro metallization of polymers is introduced. A Nd:YAG laser was employed to draw patterns on polymer surface using a special set-up. After subsequent activation and auto-catalytic electroless plating, copper only deposited on the laser tracks. Induced by the laser, porous and rough structures are formed on the surface. Using the above mentioned laser treatment; standard grades of thermoplastic materials such as ABS, SAN, PE, PC and others have been selectively metallised Ms. Yang Zhang, yazh@mek.dtu.dk. Education background:   Oct,2007 – Now: PhD candidate, Micro manufacturing, DTU Sep, 2005 – Sep, 2007: M.Sc, Polymer Engineering, DTU Sep, 2001 – Sep, 2005: B.En, Materials Science and Engineering, Beihang University, Beijing.
14:30-14:45	Pause
14:45-15:15	The PCB conquers the space Erik Rega, M. Sc., R&D Manager Mechatronics, Kromberg & Schubert GmbH 3D easy access control unit for a Motor Cycle A complete new mechatronics team analysed the market needs and defined a clear roadmap. The team created a new industrial concept to allow “real” 3D applications and called it “KroMID®”. The major difference to the standard known MID is the realisation of highly complex 3D-MID. The 3D applications produced with KroMID® are nearly free in terms of shape and construction. No longer the prerequisite exists to produce the part on standard 2,5D pick and place equipment for dispensing, lasering and soldering. The whole production philosophy was redesigned to meet the needs of 3 dimensional KroMID® applications. Within the development of KroMID® all restrictions regarding a real automotive market launch of 3D-MID (mentioned in the 3D- MID market study 2006), were solved. The completely new trend with KroMID® allows a whole new range of mechatronical applications based on a combination of full creative design, increased cost effectiveness, absolutely flexible towards modifications, more compact solutions with integration of more functions, strongly reduced process/ production chain and full automated production to guarantee automotive justified quality levels… all “Made in Germany”. Mr. Erik Rega graduated with a Master of Science to kick off his career at Tyco Electronics. After a few years he changed to the Japanese company JST to take care of managerial tasks in the engineering division. In 2005 he started at Kromberg & Schubert where he is Manager Research & Development of the Mechatronics business unit. Throughout his career, he focused on internationality in different countries like Belgium, Scandinavia, Japan, France, Singapore and Germany.
15:15-15:45	Scandinavian efforts: Polymer integration - embedding electronics into plastic products Janne Aikio, VTT, Finland In the future, the rigid electronic boards will not place restrictions in the design of new products, as the manufacturing technology is being developed towards more flexible, design-friendly and inexpensive form of electronics. New manufacturing methods will change the production processes and will enable the manufacturing of entirely new kinds of products. VTT sees a bright future in printable and plastic-based electronics and is investing in the research in this area. This presentation gives an overview on the research activities in polymer integration in VTT Technical Research Centre of Finland. Dr. Janne Aikio works as Senior Research Scientist and debuty Technology Manager in VTT Micromodules, carrying out research especially in the field of photonic system integration. Since 2006 he has been a steering group member in VTT's internal strategic project "Smart Integrated Product Structures - SIPS" for coordinating and promoting the polymer integration technology development in VTT. Dr. Aikio received his MSc in theoretical physics (1997) and PhD in physics (2004) from the University of Oulu, Finland.
15:45-16:15	Evaluering og afslutning

Arranged by
ATV•SEMAPP/the Polymer- og MicroNanogroup in cooperation with Dansk Maskinteknisk Selskab (DMS), IDA.
Furthermore the seminar is a part of the activities of the European Network of Excellence “Multi Material Micro Manufacture (4M)” (www.4m-net.org).

Organisation:
Hans Nørgaard Hansen, DTU Mekanik in collaboration with Flemming Christiansen, SP Moulding, the Polymer Technology and the MicorNano managing committees.

Moderator:
Hans Nørgaard Hansen, DTU Mekanik.

Place:
The Technical University of Denmark/Danmarks Tekniske Universitet (DTU), Anker Engelunds Vej, Meeting room 1, Building 101.

Price:
Members of ATV-SEMAPP and DMS:  DKK: 1900,- Øvrige:  DKK: 2375,-
For B.Sc. og M.Sc.-student members: DKK 100 - Not members: DKK 200.
For Ph.D. -student members: DKK 500 - Not members: DKK 700.
The price covers the fee, consumption and released material.
Information on membership here.

Registering:
Before Tuesday the 18th November 2008.
Fill in the registration form (a confirmation is sent to the registration-PC and to the registration E-mail address immediately after posting the registration form) or send an E-mail with registration information to semapp@ipl.dtu.dk.
You can also sign up to Anette Kaltoft, 09:00-12:30 on tel 4525 4717 or to Erling D. Mortensen, tel 4525 4630.
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